Research Interests

• Thermal Sciences: Buoyancy-induced flows and transport, transport in porous media, two phase flows.
  
• Electronics Packaging and Manufacturing: Thermal management, printed circuit board assembly including solder interconnect; process analysis, optimization and control using physical-neural network modeling
  
• Semiconductor Processing: Bulk crystal growth and chemical vapor deposition systems.
  
• Microsystems: MEMS as sensors and actuators in engineering and life sciences, thermal analysis, packaging